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Semi-automated Probe Systems AP-200 AP-300

Semi-automated Probe Systems  AP-200  AP-300

Temperature characteristic evaluation from -60°C to +350°C
Probe solution for high-power devices. 20kV DC/200A

◎It is a semi-automated probe systems which supports wafer sizes of 6 inch and 8 inch respectively.

◎It has a compact shield to prevent dew condensation.

◎The compact shield provides a low noise environment.

◎Probe station equipped with APOLLOWAVE proprietary software realizes high test efficiency.

◎By image recognition, automatic wafer alignment and automatic chip alignment are possible.

  • Semi-automated Probe Systems  AP-200  AP-300
  • Semi-automated Probe Systems  AP-200  AP-300
  • Application
    • Low level IV (fA)
    • Low level CV (fF)
    • Probe solution for high-power devices 20kV DC/200A
    • RF measurement
    • Various resistance measurements such as sheet resistance
    • Temperature characteristic test in high and low temperature environment
    • Reliability test such as TDDB
  • Option
    • Thermal chuck from -60°C to +350°C
    • Triaxial connection to chuck
    • High-power chuck
    • Automatic alignment by image recognition.
    • Probe card (4.5 inch square PCB)
  • Examples of measuring instruments to be connected
    • Device Analyzers/Parameter analyzers
    • Power Device Analyzer
    • Source Measure Units
    • Curve Tracers
    • Precision LCR meters
    • Digital multimeters
    • Impedance Analyzers
    • Network Analyzers
    • In addition, various measuring instruments of each company
AP-200 AP-300
Wafer chuck size ~8inch ~12inch
StageXY movement amount X:220㎜ Y:400㎜ X:320㎜ Y:500㎜
StageXYZ control resolution 0.1μm 0.1μm
StageXYZ Reproducibility ±2μm ±3μm
Stage XY Accuracy ±5μm ±10μm
StageXY moving speed 30㎜/sec(Max) 25㎜/sec(Max)
StageZaxis movement amount 30㎜ 80㎜
StageZaxis movement speed 25㎜/sec(Max) 25㎜/sec(Max)
Stage θ Stag travel ±5deg ±6deg
Stage θ resolution 0.001deg 0.000022294deg
Dimension W760×D1000×H1020㎜ W880×D1260×H1030㎜
Weight 400kg 800kg